SITC of 1.2PP Flip Chip or Chip on Board LED Video Wall 1,SITC of 1.2PP Flip Chip or Chip on Board
Ministry of Finance Department of Financial Services·Delhi
Tender Overview
- Tender Reference Number
- Tender ID
- GeM Numeric ID
- State / UT
- Delhi
- Pincode
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- District
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- Location
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- Tender Type
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- Form of Contract
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- Evaluation Type
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- Procurement Type
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- Product Category
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- Items
- SITC of 1.2PP Flip Chip or Chip on Board LED Video Wall 1,SITC of 1.2PP Flip Chip or Chip on Board
- Sub Category
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- Period of Work
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- Quantity
- 1401
- Technical Evaluation
- Financial Evaluation
- Bid Offer Validity
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Important Dates
- Published Date
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- Document Download End Date
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- Bid Start Date
- 24 Jul 2026
- Bid Closing Date
- 14 Aug 2026
- Pre Bid Meeting Date
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- Bid Opening Date
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Costs
- Estimated Tender Value
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- Document Cost
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- EMD Amount
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Tender Info
Bid Summary
SITC of 1.2PP Flip Chip or Chip on Board LED Video Wall 1,SITC of 1.2PP Flip Chip or Chip on Board
Contract Summary
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Tender Documents
BOQ
The Bill of Quantities is published inside the bid document.